Integrated Circuit Failure Analysis
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Integrated Circuit Failure Analysis
A Guide to Preparation Techniques
Beck, Friedrich
John Wiley & Sons Inc
01/1998
190
Dura
Inglês
9780471974017
15 a 20 dias
406
Descrição não disponível.
Purpose and Importance of Preparatory Semiconductor Analysis.
Opening the Package: Chip Insulation.
Wet Chemical Etching Procedures for Removing Layers of the ChipStructure.
Crystallographic Etching in the Silicon.
Dry Etching in the Plasma.
Microsectioning Technology, Metallography.
Outlook.
Appendices.
Index.
Opening the Package: Chip Insulation.
Wet Chemical Etching Procedures for Removing Layers of the ChipStructure.
Crystallographic Etching in the Silicon.
Dry Etching in the Plasma.
Microsectioning Technology, Metallography.
Outlook.
Appendices.
Index.
Este título pertence ao(s) assunto(s) indicados(s). Para ver outros títulos clique no assunto desejado.
indispensable; analysis; circuits; optimization; highlyintegrated; fault; semiconductor; quality; discipline; product; failure analysis; sites; integrated; stateoftheart; describes; circuit; procedures; devices; author; handson; approach
Purpose and Importance of Preparatory Semiconductor Analysis.
Opening the Package: Chip Insulation.
Wet Chemical Etching Procedures for Removing Layers of the ChipStructure.
Crystallographic Etching in the Silicon.
Dry Etching in the Plasma.
Microsectioning Technology, Metallography.
Outlook.
Appendices.
Index.
Opening the Package: Chip Insulation.
Wet Chemical Etching Procedures for Removing Layers of the ChipStructure.
Crystallographic Etching in the Silicon.
Dry Etching in the Plasma.
Microsectioning Technology, Metallography.
Outlook.
Appendices.
Index.
Este título pertence ao(s) assunto(s) indicados(s). Para ver outros títulos clique no assunto desejado.
