Lead-free Electronics
-15%
portes grátis
Lead-free Electronics
Pecht, Michael G.; Ganesan, Sanka
John Wiley & Sons Inc
03/2006
800
Dura
Inglês
9780471786177
15 a 20 dias
1284
Descrição não disponível.
Preface. Editors.
Contributors.
Acknowledgements.
Chapter 1. Lead-Free Electronics: Overview.
Chapter 2. Lead-Free Legislations, Exemptions & Compliance.
Chapter 3. Lead-Free Alloys: Overview.
Chapter 4. Lead-Free Manufacturing.
Chapter 5. Review of Lead-Free Solder Joint Reliability.
Chapter 6. Constitutive Properties and Durability of Selected Lead-Free Solders.
Chapter 7. Interfacial Reactions and Performance of Lead-Free Solder Joints.
Chapter 8. Conductive Adhesives.
Chapter 9. Component-Level Issues in Lead-Free Electronics.
Chapter 10. Tin Whiskers in Electronics.
Chapter 11. Lead-Free Separable Contacts and Connectors.
Chapter 12 Intellectural Property.
Chapter 13. Costs to Lead-Free Migration.
Chapter 14. Lead-Free Technologies in the Japanese Electronics Industry.
Chapter 15. Guidelines for Implementing Lead-Free Electronics.
Index.
Contributors.
Acknowledgements.
Chapter 1. Lead-Free Electronics: Overview.
Chapter 2. Lead-Free Legislations, Exemptions & Compliance.
Chapter 3. Lead-Free Alloys: Overview.
Chapter 4. Lead-Free Manufacturing.
Chapter 5. Review of Lead-Free Solder Joint Reliability.
Chapter 6. Constitutive Properties and Durability of Selected Lead-Free Solders.
Chapter 7. Interfacial Reactions and Performance of Lead-Free Solder Joints.
Chapter 8. Conductive Adhesives.
Chapter 9. Component-Level Issues in Lead-Free Electronics.
Chapter 10. Tin Whiskers in Electronics.
Chapter 11. Lead-Free Separable Contacts and Connectors.
Chapter 12 Intellectural Property.
Chapter 13. Costs to Lead-Free Migration.
Chapter 14. Lead-Free Technologies in the Japanese Electronics Industry.
Chapter 15. Guidelines for Implementing Lead-Free Electronics.
Index.
Este título pertence ao(s) assunto(s) indicados(s). Para ver outros títulos clique no assunto desejado.
electronics; technical; design; leadfree; provides; use; state legislation; transition; complex; industry; challenges; property; costs; anticipating; supply; issues; potential; chain; applications; intellectual; whiskers; solutions
Preface. Editors.
Contributors.
Acknowledgements.
Chapter 1. Lead-Free Electronics: Overview.
Chapter 2. Lead-Free Legislations, Exemptions & Compliance.
Chapter 3. Lead-Free Alloys: Overview.
Chapter 4. Lead-Free Manufacturing.
Chapter 5. Review of Lead-Free Solder Joint Reliability.
Chapter 6. Constitutive Properties and Durability of Selected Lead-Free Solders.
Chapter 7. Interfacial Reactions and Performance of Lead-Free Solder Joints.
Chapter 8. Conductive Adhesives.
Chapter 9. Component-Level Issues in Lead-Free Electronics.
Chapter 10. Tin Whiskers in Electronics.
Chapter 11. Lead-Free Separable Contacts and Connectors.
Chapter 12 Intellectural Property.
Chapter 13. Costs to Lead-Free Migration.
Chapter 14. Lead-Free Technologies in the Japanese Electronics Industry.
Chapter 15. Guidelines for Implementing Lead-Free Electronics.
Index.
Contributors.
Acknowledgements.
Chapter 1. Lead-Free Electronics: Overview.
Chapter 2. Lead-Free Legislations, Exemptions & Compliance.
Chapter 3. Lead-Free Alloys: Overview.
Chapter 4. Lead-Free Manufacturing.
Chapter 5. Review of Lead-Free Solder Joint Reliability.
Chapter 6. Constitutive Properties and Durability of Selected Lead-Free Solders.
Chapter 7. Interfacial Reactions and Performance of Lead-Free Solder Joints.
Chapter 8. Conductive Adhesives.
Chapter 9. Component-Level Issues in Lead-Free Electronics.
Chapter 10. Tin Whiskers in Electronics.
Chapter 11. Lead-Free Separable Contacts and Connectors.
Chapter 12 Intellectural Property.
Chapter 13. Costs to Lead-Free Migration.
Chapter 14. Lead-Free Technologies in the Japanese Electronics Industry.
Chapter 15. Guidelines for Implementing Lead-Free Electronics.
Index.
Este título pertence ao(s) assunto(s) indicados(s). Para ver outros títulos clique no assunto desejado.
