Integrated Passive Component Technology
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Integrated Passive Component Technology
Ulrich, Richard K.; Schaper, Leonard W.
John Wiley & Sons Inc
07/2003
379
Dura
Inglês
9780471244318
15 a 20 dias
782
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Contributors. Preface.
1 Introduction (Richard K. Ulrich).
1.1 Status and Trends in Discrete Passive Components.
1.2 Definitions and Configurations of Integrated Passives.
1.3 Comparison to Integrated Active Devices.
1.4 Substrates and Interconnect Systems for Integrated Passives.
1.5 Fabrication of Integrated Passives.
1.6 Reasons for Integrating Passive Devices.
1.7 Problems with Integrating Passive Devices.
1.8 Applications for Integrated Passives.
1.9 The Past and Future of Integrated Passives.
1.10 Organization of this Book.
References.
2 Characteristics and Performance of Planar Resistors (Richard K. Ulrich).
2.1 Performance Parameters.
2.2 Resistance in Electronic Materials.
2.3 Sizing Integrated Resistors.
2.4 Trimming.
References.
3 Integrated Resistor Materials and Processes (Richard K. Ulrich).
3.1 Single-Component Metals.
3.2 Metal Alloys and Metal-Nonmetal Compounds.
3.3 Semiconductors.
3.4 Cermets.
3.5 Polymer Thick Film.
3.6 Ink Jet Deposition.
3.7 Commercialized Processes.
3.8 Summary.
References.
4 Dielectric Materials for Integrated Capacitors (Richard K. Ulrich).
4.1 Polarizability and Capacitance.
4.2 Capacitance Density.
4.3 Temperature Effects.
4.4 Frequency and Voltage Effects.
4.5 Aging Effects.
4.6 Composition and Morphology Effects.
4.7 Leakage and Breakdown.
4.8 Dissipation Factor.
4.9 Comparison to EIA Dielectric Classifications.
4.10 Matching Dielectric Materials to Applications.
References.
5 Size and Configuration of Integrated Capacitors (Richard K. Ulrich).
5.1 Comparison of Integrated and Discrete Areas.
5.2 Layout Options.
5.3 Tolerance.
5.4 Mixed Dielectric Strategies.
5.5 CV Product.
5.6 Maximum Capacitance Density and Breakdown Voltage.
References.
6 Processing Integrated Capacitors (Richard K. Ulrich).
6.1 Sputtering.
6.2 CVD, PECVD and MOCVD.
6.3 Anodization.
6.4 Sol-Gel and Hydrothermal Ferroelectrics.
6.5 Thin- and Thick-Film Polymers.
6.6 Thick-Film Dielectrics.
6.7 Interlayer Insulation.
6.8 Interdigitated Capacitors.
6.9 Capacitor Plate Materials.
6.10 Trimming Integrated Capacitors.
6.11 Commercialized Integrated Capacitor Technologies.
6.12 Summary.
References.
7 Defects and Yield Issues (Richard K. Ulrich).
7.1 Causes of Fatal Defects in Integrated Capacitors.
7.2 Measurement of Defect Density.
7.3 Defect Density and System Yield.
7.3.1 Predicting Yield from Defect Density.
7.4 Yield Enhancement Techniques for Capacitors.
7.5 Conclusions.
References.
8 Electrical Performance of Integrated Capacitors (Richard K. Ulrich and Leonard W. Schaper).
8.1 Modeling Ideal Passives.
8.2 Modeling Real Capacitors.
8.3 Electrical Performance of Discrete and Integrated Capacitors.
8.4 Dissipation Factor of Real Capacitors.
8.5 Measurement of Capacitor Properties.
8.6 Summary.
References.
9 Decoupling (Leonard W. Schaper).
9.1 Power Distribution.
9.2 Decoupling with Discrete Capacitors.
9.3 Decoupling with Integrated Capacitors.
9.4 Dielectrics and Configurations for Integrated Decoupling.
9.5 Integrated Decoupling as an Entry Application.
References.
10 Integrated Inductors (Geert J. Carchon and Walter De Raedt).
10.1 Introduction.
10.2 Inductor Behavior and Performance Parameters.
10.3 Inductor Performance Prediction.
10.4 Integrated Inductor Examples.
10.5 Use of Inductors in Circuits: Examples.
10.6 Conclusions.
Acknowledgments.
References.
11 Modeling of Integrated Inductors and Resistors for Microwave Applications (Zhenwen Wang, M. Jamal Deen, and A. H. Rahal).
11.1 Introduction.
11.2 Modeling of Spiral Inductors.
11.3 Modeling of Thin-Film Resistors.
11.4 Conclusions.
References.
Appendix: Characteristics of Microscript Lines.
12 Other Applications and Integration Technologies (Elizabeth Logan, Geert J. Carchon, Walter De Raedt, Richard K. Ulrich, and Leonard W. Schaper).
12.1 Demonstration Devices Fabricated with Integrated Passives.
12.2 Commercialized Thin-Film Build-Up Integrated Passives.
12.3 Other Integrated Passive Technologies.
12.4 Summary.
Acknowledgments.
References.
13 The Economics of Embedded Passives (Peter A. Sandborn).
13.1 Introduction.
13.2 Modeling Embedded Passive Economics.
13.3 Key Aspects of Modeling Embedded Passive Costs.
13.4 Example Case Studies.
13.5 Summary.
Acknowledgments.
References.
14 The Future of Integrated Passives (Richard K. Ulrich).
14.1 Status of Passive Integration.
14.2 Issues for Implementation on Organic Substrates.
14.3 Progress on Board-Level Implementation.
14.4 Three Ways In for Organic Boards.
14.5 Conclusion.
Index.
About the Editors.
1 Introduction (Richard K. Ulrich).
1.1 Status and Trends in Discrete Passive Components.
1.2 Definitions and Configurations of Integrated Passives.
1.3 Comparison to Integrated Active Devices.
1.4 Substrates and Interconnect Systems for Integrated Passives.
1.5 Fabrication of Integrated Passives.
1.6 Reasons for Integrating Passive Devices.
1.7 Problems with Integrating Passive Devices.
1.8 Applications for Integrated Passives.
1.9 The Past and Future of Integrated Passives.
1.10 Organization of this Book.
References.
2 Characteristics and Performance of Planar Resistors (Richard K. Ulrich).
2.1 Performance Parameters.
2.2 Resistance in Electronic Materials.
2.3 Sizing Integrated Resistors.
2.4 Trimming.
References.
3 Integrated Resistor Materials and Processes (Richard K. Ulrich).
3.1 Single-Component Metals.
3.2 Metal Alloys and Metal-Nonmetal Compounds.
3.3 Semiconductors.
3.4 Cermets.
3.5 Polymer Thick Film.
3.6 Ink Jet Deposition.
3.7 Commercialized Processes.
3.8 Summary.
References.
4 Dielectric Materials for Integrated Capacitors (Richard K. Ulrich).
4.1 Polarizability and Capacitance.
4.2 Capacitance Density.
4.3 Temperature Effects.
4.4 Frequency and Voltage Effects.
4.5 Aging Effects.
4.6 Composition and Morphology Effects.
4.7 Leakage and Breakdown.
4.8 Dissipation Factor.
4.9 Comparison to EIA Dielectric Classifications.
4.10 Matching Dielectric Materials to Applications.
References.
5 Size and Configuration of Integrated Capacitors (Richard K. Ulrich).
5.1 Comparison of Integrated and Discrete Areas.
5.2 Layout Options.
5.3 Tolerance.
5.4 Mixed Dielectric Strategies.
5.5 CV Product.
5.6 Maximum Capacitance Density and Breakdown Voltage.
References.
6 Processing Integrated Capacitors (Richard K. Ulrich).
6.1 Sputtering.
6.2 CVD, PECVD and MOCVD.
6.3 Anodization.
6.4 Sol-Gel and Hydrothermal Ferroelectrics.
6.5 Thin- and Thick-Film Polymers.
6.6 Thick-Film Dielectrics.
6.7 Interlayer Insulation.
6.8 Interdigitated Capacitors.
6.9 Capacitor Plate Materials.
6.10 Trimming Integrated Capacitors.
6.11 Commercialized Integrated Capacitor Technologies.
6.12 Summary.
References.
7 Defects and Yield Issues (Richard K. Ulrich).
7.1 Causes of Fatal Defects in Integrated Capacitors.
7.2 Measurement of Defect Density.
7.3 Defect Density and System Yield.
7.3.1 Predicting Yield from Defect Density.
7.4 Yield Enhancement Techniques for Capacitors.
7.5 Conclusions.
References.
8 Electrical Performance of Integrated Capacitors (Richard K. Ulrich and Leonard W. Schaper).
8.1 Modeling Ideal Passives.
8.2 Modeling Real Capacitors.
8.3 Electrical Performance of Discrete and Integrated Capacitors.
8.4 Dissipation Factor of Real Capacitors.
8.5 Measurement of Capacitor Properties.
8.6 Summary.
References.
9 Decoupling (Leonard W. Schaper).
9.1 Power Distribution.
9.2 Decoupling with Discrete Capacitors.
9.3 Decoupling with Integrated Capacitors.
9.4 Dielectrics and Configurations for Integrated Decoupling.
9.5 Integrated Decoupling as an Entry Application.
References.
10 Integrated Inductors (Geert J. Carchon and Walter De Raedt).
10.1 Introduction.
10.2 Inductor Behavior and Performance Parameters.
10.3 Inductor Performance Prediction.
10.4 Integrated Inductor Examples.
10.5 Use of Inductors in Circuits: Examples.
10.6 Conclusions.
Acknowledgments.
References.
11 Modeling of Integrated Inductors and Resistors for Microwave Applications (Zhenwen Wang, M. Jamal Deen, and A. H. Rahal).
11.1 Introduction.
11.2 Modeling of Spiral Inductors.
11.3 Modeling of Thin-Film Resistors.
11.4 Conclusions.
References.
Appendix: Characteristics of Microscript Lines.
12 Other Applications and Integration Technologies (Elizabeth Logan, Geert J. Carchon, Walter De Raedt, Richard K. Ulrich, and Leonard W. Schaper).
12.1 Demonstration Devices Fabricated with Integrated Passives.
12.2 Commercialized Thin-Film Build-Up Integrated Passives.
12.3 Other Integrated Passive Technologies.
12.4 Summary.
Acknowledgments.
References.
13 The Economics of Embedded Passives (Peter A. Sandborn).
13.1 Introduction.
13.2 Modeling Embedded Passive Economics.
13.3 Key Aspects of Modeling Embedded Passive Costs.
13.4 Example Case Studies.
13.5 Summary.
Acknowledgments.
References.
14 The Future of Integrated Passives (Richard K. Ulrich).
14.1 Status of Passive Integration.
14.2 Issues for Implementation on Organic Substrates.
14.3 Progress on Board-Level Implementation.
14.4 Three Ways In for Organic Boards.
14.5 Conclusion.
Index.
About the Editors.
Este título pertence ao(s) assunto(s) indicados(s). Para ver outros títulos clique no assunto desejado.
passives; integrated; important; technology; book; realworld; future; overview; status; potential; resistors; surface; inductors; mounting; boards; discrete components; circuit; passive; scientists; integration; industry; viable option; engineers
Contributors. Preface.
1 Introduction (Richard K. Ulrich).
1.1 Status and Trends in Discrete Passive Components.
1.2 Definitions and Configurations of Integrated Passives.
1.3 Comparison to Integrated Active Devices.
1.4 Substrates and Interconnect Systems for Integrated Passives.
1.5 Fabrication of Integrated Passives.
1.6 Reasons for Integrating Passive Devices.
1.7 Problems with Integrating Passive Devices.
1.8 Applications for Integrated Passives.
1.9 The Past and Future of Integrated Passives.
1.10 Organization of this Book.
References.
2 Characteristics and Performance of Planar Resistors (Richard K. Ulrich).
2.1 Performance Parameters.
2.2 Resistance in Electronic Materials.
2.3 Sizing Integrated Resistors.
2.4 Trimming.
References.
3 Integrated Resistor Materials and Processes (Richard K. Ulrich).
3.1 Single-Component Metals.
3.2 Metal Alloys and Metal-Nonmetal Compounds.
3.3 Semiconductors.
3.4 Cermets.
3.5 Polymer Thick Film.
3.6 Ink Jet Deposition.
3.7 Commercialized Processes.
3.8 Summary.
References.
4 Dielectric Materials for Integrated Capacitors (Richard K. Ulrich).
4.1 Polarizability and Capacitance.
4.2 Capacitance Density.
4.3 Temperature Effects.
4.4 Frequency and Voltage Effects.
4.5 Aging Effects.
4.6 Composition and Morphology Effects.
4.7 Leakage and Breakdown.
4.8 Dissipation Factor.
4.9 Comparison to EIA Dielectric Classifications.
4.10 Matching Dielectric Materials to Applications.
References.
5 Size and Configuration of Integrated Capacitors (Richard K. Ulrich).
5.1 Comparison of Integrated and Discrete Areas.
5.2 Layout Options.
5.3 Tolerance.
5.4 Mixed Dielectric Strategies.
5.5 CV Product.
5.6 Maximum Capacitance Density and Breakdown Voltage.
References.
6 Processing Integrated Capacitors (Richard K. Ulrich).
6.1 Sputtering.
6.2 CVD, PECVD and MOCVD.
6.3 Anodization.
6.4 Sol-Gel and Hydrothermal Ferroelectrics.
6.5 Thin- and Thick-Film Polymers.
6.6 Thick-Film Dielectrics.
6.7 Interlayer Insulation.
6.8 Interdigitated Capacitors.
6.9 Capacitor Plate Materials.
6.10 Trimming Integrated Capacitors.
6.11 Commercialized Integrated Capacitor Technologies.
6.12 Summary.
References.
7 Defects and Yield Issues (Richard K. Ulrich).
7.1 Causes of Fatal Defects in Integrated Capacitors.
7.2 Measurement of Defect Density.
7.3 Defect Density and System Yield.
7.3.1 Predicting Yield from Defect Density.
7.4 Yield Enhancement Techniques for Capacitors.
7.5 Conclusions.
References.
8 Electrical Performance of Integrated Capacitors (Richard K. Ulrich and Leonard W. Schaper).
8.1 Modeling Ideal Passives.
8.2 Modeling Real Capacitors.
8.3 Electrical Performance of Discrete and Integrated Capacitors.
8.4 Dissipation Factor of Real Capacitors.
8.5 Measurement of Capacitor Properties.
8.6 Summary.
References.
9 Decoupling (Leonard W. Schaper).
9.1 Power Distribution.
9.2 Decoupling with Discrete Capacitors.
9.3 Decoupling with Integrated Capacitors.
9.4 Dielectrics and Configurations for Integrated Decoupling.
9.5 Integrated Decoupling as an Entry Application.
References.
10 Integrated Inductors (Geert J. Carchon and Walter De Raedt).
10.1 Introduction.
10.2 Inductor Behavior and Performance Parameters.
10.3 Inductor Performance Prediction.
10.4 Integrated Inductor Examples.
10.5 Use of Inductors in Circuits: Examples.
10.6 Conclusions.
Acknowledgments.
References.
11 Modeling of Integrated Inductors and Resistors for Microwave Applications (Zhenwen Wang, M. Jamal Deen, and A. H. Rahal).
11.1 Introduction.
11.2 Modeling of Spiral Inductors.
11.3 Modeling of Thin-Film Resistors.
11.4 Conclusions.
References.
Appendix: Characteristics of Microscript Lines.
12 Other Applications and Integration Technologies (Elizabeth Logan, Geert J. Carchon, Walter De Raedt, Richard K. Ulrich, and Leonard W. Schaper).
12.1 Demonstration Devices Fabricated with Integrated Passives.
12.2 Commercialized Thin-Film Build-Up Integrated Passives.
12.3 Other Integrated Passive Technologies.
12.4 Summary.
Acknowledgments.
References.
13 The Economics of Embedded Passives (Peter A. Sandborn).
13.1 Introduction.
13.2 Modeling Embedded Passive Economics.
13.3 Key Aspects of Modeling Embedded Passive Costs.
13.4 Example Case Studies.
13.5 Summary.
Acknowledgments.
References.
14 The Future of Integrated Passives (Richard K. Ulrich).
14.1 Status of Passive Integration.
14.2 Issues for Implementation on Organic Substrates.
14.3 Progress on Board-Level Implementation.
14.4 Three Ways In for Organic Boards.
14.5 Conclusion.
Index.
About the Editors.
1 Introduction (Richard K. Ulrich).
1.1 Status and Trends in Discrete Passive Components.
1.2 Definitions and Configurations of Integrated Passives.
1.3 Comparison to Integrated Active Devices.
1.4 Substrates and Interconnect Systems for Integrated Passives.
1.5 Fabrication of Integrated Passives.
1.6 Reasons for Integrating Passive Devices.
1.7 Problems with Integrating Passive Devices.
1.8 Applications for Integrated Passives.
1.9 The Past and Future of Integrated Passives.
1.10 Organization of this Book.
References.
2 Characteristics and Performance of Planar Resistors (Richard K. Ulrich).
2.1 Performance Parameters.
2.2 Resistance in Electronic Materials.
2.3 Sizing Integrated Resistors.
2.4 Trimming.
References.
3 Integrated Resistor Materials and Processes (Richard K. Ulrich).
3.1 Single-Component Metals.
3.2 Metal Alloys and Metal-Nonmetal Compounds.
3.3 Semiconductors.
3.4 Cermets.
3.5 Polymer Thick Film.
3.6 Ink Jet Deposition.
3.7 Commercialized Processes.
3.8 Summary.
References.
4 Dielectric Materials for Integrated Capacitors (Richard K. Ulrich).
4.1 Polarizability and Capacitance.
4.2 Capacitance Density.
4.3 Temperature Effects.
4.4 Frequency and Voltage Effects.
4.5 Aging Effects.
4.6 Composition and Morphology Effects.
4.7 Leakage and Breakdown.
4.8 Dissipation Factor.
4.9 Comparison to EIA Dielectric Classifications.
4.10 Matching Dielectric Materials to Applications.
References.
5 Size and Configuration of Integrated Capacitors (Richard K. Ulrich).
5.1 Comparison of Integrated and Discrete Areas.
5.2 Layout Options.
5.3 Tolerance.
5.4 Mixed Dielectric Strategies.
5.5 CV Product.
5.6 Maximum Capacitance Density and Breakdown Voltage.
References.
6 Processing Integrated Capacitors (Richard K. Ulrich).
6.1 Sputtering.
6.2 CVD, PECVD and MOCVD.
6.3 Anodization.
6.4 Sol-Gel and Hydrothermal Ferroelectrics.
6.5 Thin- and Thick-Film Polymers.
6.6 Thick-Film Dielectrics.
6.7 Interlayer Insulation.
6.8 Interdigitated Capacitors.
6.9 Capacitor Plate Materials.
6.10 Trimming Integrated Capacitors.
6.11 Commercialized Integrated Capacitor Technologies.
6.12 Summary.
References.
7 Defects and Yield Issues (Richard K. Ulrich).
7.1 Causes of Fatal Defects in Integrated Capacitors.
7.2 Measurement of Defect Density.
7.3 Defect Density and System Yield.
7.3.1 Predicting Yield from Defect Density.
7.4 Yield Enhancement Techniques for Capacitors.
7.5 Conclusions.
References.
8 Electrical Performance of Integrated Capacitors (Richard K. Ulrich and Leonard W. Schaper).
8.1 Modeling Ideal Passives.
8.2 Modeling Real Capacitors.
8.3 Electrical Performance of Discrete and Integrated Capacitors.
8.4 Dissipation Factor of Real Capacitors.
8.5 Measurement of Capacitor Properties.
8.6 Summary.
References.
9 Decoupling (Leonard W. Schaper).
9.1 Power Distribution.
9.2 Decoupling with Discrete Capacitors.
9.3 Decoupling with Integrated Capacitors.
9.4 Dielectrics and Configurations for Integrated Decoupling.
9.5 Integrated Decoupling as an Entry Application.
References.
10 Integrated Inductors (Geert J. Carchon and Walter De Raedt).
10.1 Introduction.
10.2 Inductor Behavior and Performance Parameters.
10.3 Inductor Performance Prediction.
10.4 Integrated Inductor Examples.
10.5 Use of Inductors in Circuits: Examples.
10.6 Conclusions.
Acknowledgments.
References.
11 Modeling of Integrated Inductors and Resistors for Microwave Applications (Zhenwen Wang, M. Jamal Deen, and A. H. Rahal).
11.1 Introduction.
11.2 Modeling of Spiral Inductors.
11.3 Modeling of Thin-Film Resistors.
11.4 Conclusions.
References.
Appendix: Characteristics of Microscript Lines.
12 Other Applications and Integration Technologies (Elizabeth Logan, Geert J. Carchon, Walter De Raedt, Richard K. Ulrich, and Leonard W. Schaper).
12.1 Demonstration Devices Fabricated with Integrated Passives.
12.2 Commercialized Thin-Film Build-Up Integrated Passives.
12.3 Other Integrated Passive Technologies.
12.4 Summary.
Acknowledgments.
References.
13 The Economics of Embedded Passives (Peter A. Sandborn).
13.1 Introduction.
13.2 Modeling Embedded Passive Economics.
13.3 Key Aspects of Modeling Embedded Passive Costs.
13.4 Example Case Studies.
13.5 Summary.
Acknowledgments.
References.
14 The Future of Integrated Passives (Richard K. Ulrich).
14.1 Status of Passive Integration.
14.2 Issues for Implementation on Organic Substrates.
14.3 Progress on Board-Level Implementation.
14.4 Three Ways In for Organic Boards.
14.5 Conclusion.
Index.
About the Editors.
Este título pertence ao(s) assunto(s) indicados(s). Para ver outros títulos clique no assunto desejado.
